Organic light emitting display devices and methods of manufacturing organic light emitting display devices

ABSTRACT

An organic light emitting display device includes a first substrate, an organic light emitting structure, a peripheral circuit, a recess, a black matrix and a polarization structure. The first substrate may include a display region and a peripheral region. The peripheral region may surround the display region or extend along at least one side of the display region. The organic light emitting structure may be disposed over a first face of the first substrate in the display region. The peripheral circuit may be disposed over the first face of the first substrate in the peripheral region. The recess may be disposed on a second face of the first substrate in the peripheral region. The black matrix may be disposed in the recess. The polarization structure may be disposed over the black matrix and the second face of the first substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority under 35 USC §119 to Korean PatentApplication No. 10-2012-0006073 filed on Jan. 19, 2012 in the KoreanIntellectual Property Office (KIPO), the contents of which are hereinincorporated by reference in its entirety.

BACKGROUND

1. Field

The present disclosure relates to organic light emitting display devicesand methods of manufacturing organic light emitting display devices.

2. Related Technology

An organic light emitting display (OLED) device may display desiredinformation such as images, letters and/or characters using lightgenerated by combining holes provided from an anode with electronsprovided from a cathode in an organic layer thereof. The OLED device mayensure relatively large view angle, rapid response speed, smallthickness, low power consumption, etc. Accordingly the OLED device maybe certainly expected to be one of the most prospecting next-generationdisplay devices.

The OLED device may include a display region and a peripheral region. Anorganic light emitting display structure may be disposed in the displayregion and a peripheral circuit may be located in the peripheral region.To shield the peripheral circuit from a user, a frame or a lightshielding layer may be disposed to cover the peripheral region. Theforegoing discussion is to provide general background information, anddoes not constitute an admission of prior art.

SUMMARY

When the light shielding layer such as a black matrix is disposedbetween a polarization film and a display panel, a gap or an air bubblemay be generated therebetween due to a step between the black matrix andthe substrate. Further, mechanical strength of the OLED device may alsodecrease. Thus, one aspect provides organic light emitting displaydevices ensuring improved mechanical strength and visibility.

Another aspect provides methods of manufacturing organic light emittingdisplay devices having enhanced mechanical strength and visibility.

According to embodiments, there is provided an organic light emittingdisplay device including a first substrate, an organic light emittingstructure, a peripheral circuit portion, a recess, a black matrix and apolarization structure. The first substrate includes a display regionand a peripheral region next to at least one side of the display region.The organic light emitting structure is disposed over a first face ofthe first substrate in the display region. The peripheral circuitportion is disposed over the first face of the first substrate in theperipheral region. The recess is disposed on a second face of the firstsubstrate in the peripheral region, the second face being opposite tothe first face. The black matrix is disposed in the recess. Thepolarization structure is disposed over the black matrix and the secondface of the first substrate.

In embodiments, the recess may have a width of about 5 mm to about 15mm. A ratio of a depth of the recess to the width of the recess may beabout 1:250 to about 1:5,000. A depth of the recess may be substantiallythe same as a thickness of the black matrix.

In embodiments, the black matrix may include black silicon or carbonblack.

In embodiments, the peripheral region may surround the display region.

In embodiments, the black matrix may have a size substantially the sameas a size of the recess. A surface of the black matrix and the secondface of the first substrate may be positioned on the same plane.

In embodiments, the black matrix may have a line shape, a bent lineshape, a curve line shape, a “U” shape, a rectangular band shape, anelliptic band shape, a circular band shape and a polygonal band shape,etc., when viewed in a direction perpendicular to the second face.

In embodiments, the organic light emitting display device may furtherinclude a switching structure disposed between the first substrate andthe organic light emitting structure in the display region. A secondsubstrate may oppose the first substrate. A sealant may interconnect thefirst substrate and the second substrate.

According to embodiments, there is provided a method of manufacturing apolarization structure. In the method, a display panel having a displayregion and a peripheral region is provided. The display panel includes afirst substrate, an organic light emitting structure disposed over afirst face of the first substrate and a peripheral circuit disposed overthe first face of the first substrate. The first substrate is partiallyremoved to form a recess on a second face of the first substrate in theperipheral region. A black matrix is formed in the recess. Apolarization structure is formed over the second face of the firstsubstrate and the black matrix.

In embodiments, the peripheral region may be positioned next to at leastone side of the display region.

In embodiments, the peripheral region may surround the display region.

In embodiments, the recess may have a width of about 5 mm to about 15mm. A ratio of a depth of the recess to the width of the recess may beabout 1:250 to about 1:5,000.

In embodiments, the black matrix may have a size substantially the sameas a size of the recess. The black matrix may be formed to have a lineshape, a bent line shape, a curved line shape, a “U” shape, arectangular band shape, an elliptic band shape, a circular band shapeand a polygonal band shape, etc. when viewed in a directionperpendicular to the second face. A surface of the black matrix and thesecond face of the first substrate may be located on the same plane.

In embodiments, the black matrix may be formed using black silicon orcarbon black.

In embodiments, the first substrate may include a transparent ceramicsubstrate and forming the recess may include a dry etching process or awet etching process.

In embodiments, the first substrate may include a transparent polymersubstrate and forming the recess may include a polishing process.

According to embodiments, an organic light emitting display device mayinclude a black matrix filling a recess which may be disposed on a firstsubstrate in a peripheral region. The black matrix may serve as a lightshielding layer, such that an additional frame or a bezel for shieldinga peripheral circuit may be omitted. Additionally, a gap or an airbubble may not be generated between the first substrate and apolarization structure or between the black matrix and the polarizationstructure to thereby improve mechanical strength of the organic lightemitting display device.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings. FIGS. 1to 8 represent non-limiting, embodiments as described herein.

FIG. 1 is a cross-sectional view illustrating an organic light emittingdisplay device in accordance with embodiments;

FIG. 2 is a plan view illustrating a substrate having a black matrix inaccordance with embodiments;

FIG. 3 is a cross-sectional view illustrating an organic light emittingdisplay device in accordance with some embodiments;

FIG. 4 is a plan view illustrating a substrate having a black matrix inaccordance with some embodiments; and

FIGS. 5 to 8 are cross-sectional views illustrating a method ofmanufacturing an organic light emitting display device in accordancewith embodiments.

DESCRIPTION OF EMBODIMENTS

Various embodiments will be described more fully hereinafter withreference to the accompanying drawings, in which some embodiments areshown. The invention may, however, be embodied in many different formsand should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this descriptionwill be thorough and complete, and will fully convey the scope of theinvention to those skilled in the art. In the drawings, the sizes andrelative sizes of layers and regions may be exaggerated for clarity.

It will be understood that when an element or layer is referred to asbeing “on,” “connected to” or “coupled to” another element or layer, itcan be directly on, connected or coupled to the other element or layer;or intervening elements or layers may be present between the element orlayer and the other element or layer. In contrast, when an element isreferred to as being “directly on,” “directly connected to” or “directlycoupled to” another element or layer, there are no intervening elementsor layers, present. Like numerals refer to like elements throughout. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another region, layer or section. Thus, a first element,component, region, layer or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(for example, rotated 90 degrees or at other orientations) and thespatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a,” “an” and “the” are intended toinclude a plurality of forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises” and/or “comprising,” when used in this specification,specify the presence of stated features, integers, steps, operations,elements, and/or components, but do not preclude the presence oraddition of one or more other features, integers, steps, operations,elements, components, and/or groups thereof.

Embodiments are described herein with reference to cross-sectionalillustrations that are schematic illustrations of idealized embodiments(and intermediate structures). As such, variations from the shapes ofthe illustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments should not beconstrued as limited to the particular shapes of regions illustratedherein but are to include deviations in shapes that result, for example,from manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the face through which the implantationtakes place. Thus, the regions illustrated in the figures are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to limit the scope ofthe invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms, such as those defined in commonly useddictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art andwill not be interpreted in an idealized or overly formal sense unlessexpressly so defined herein.

FIG. 1 is a cross-sectional view illustrating an organic light emittingdisplay device in accordance with embodiments, and FIG. 2 is a plan viewillustrating a substrate having a black matrix in accordance withembodiments.

Referring to FIG. 1, an organic light emitting display device 100 inaccordance with embodiments may include a first substrate 110, a blackmatrix 120, a polarization structure 130, a switching structure 140, anorganic light emitting structure 150, a peripheral circuit unit 160, asecond substrate 170, a sealant 180, etc.

In embodiments, the switching structure 140, the organic light emittingstructure 150 and the peripheral circuit unit 160 may be disposedbetween a first face of the first substrate 110 and the second substrate170, and the black matrix 120 may be disposed between a second face ofthe first substrate 110 and the polarization structure 130. For example,when the organic light emitting display device 100 has a bottom emissiontype, the black matrix 120 may be positioned on the second face of thefirst substrate 110. Further, the switching structure 140, the organiclight emitting structure 150 and the peripheral circuit unit 160 aredisposed on the first face of the first substrate 110.

The first substrate 110 may include a transparent insulating substrate.For example, the first substrate 110 may include one of a glasssubstrate, a quartz substrate, a transparent resin substrate, etc. Insome embodiments, the first substrate 110 may include a flexiblesubstrate.

Referring to FIG. 2, the first substrate 110 may include a displayregion I and a peripheral region II which may substantially surround orenclose the display region I. For example, the peripheral region II mayextend throughout four sides of the display region I to surround thedisplay region I. An organic light emitting structure 150 may bepositioned in the display region I, and the peripheral circuit unit 160including a peripheral circuit may be positioned in the peripheralregion II.

A recess 115 may be positioned on the second face of the first substrate110 in the peripheral region II. In embodiments, the recess 115 mayentirely cover the peripheral region II or may be formed throughout theperipheral region II. In some embodiments, the recess 115 maysubstantially cover at least a portion of the peripheral region II. Forexample, the recess 115 may have one of various shapes such assubstantially a rectangular band shape, a substantially elliptic bandshape, a substantially circular band shape, a substantially polygonalband shape, etc. when viewed in a direction perpendicular to the secondface. The recess 115 may have a depth in a range of about 5 μm to about20 μm when measured from the second face of the first substrate 110.Therefore, a step portion may be generated on the first substrate 110between the display region I and the peripheral region II. Additionally,the recess 115 may have a width of about 5 mm to about 15 mm. Therefore,a ratio of the depth to the width of the recess 115 may be in a range ofabout 1:250 to about 1:5,000.

The black matrix 120 may be disposed in the recess 115. For example, theblack matrix 120 may include black silicon, carbon black, etc. Inembodiments, the black matrix 120 may have a height substantially thesame as the depth of the recess 115. The black matrix 120 maysubstantially fill the recess 115, and thus the second face of the firstsubstrate 110 and a face of the black matrix 120 may form asubstantially flat face. That is, a step may not be formed between thesecond face of the first substrate 110 and the face of the black matrix120. In embodiments, the black matrix 120 may entirely fill the recess115, such that the black matrix 120 may have a width in a range of about5 mm to about 15 mm. Therefore, a ratio of the height to the width ofthe black matrix may be about 1:250 to about 1:5,000. That is, the blackmatrix 120 may have a size substantially the same as or substantiallysimilar to that of the recess 115. In an alternative embodiment, theblack matrix 120 may have a height smaller than the depth of the recess115.

Referring to FIG. 1, the polarization structure 130 may be disposed onthe second face of the first substrate 110 and the face of the blackmatrix 120. The polarization structure 130 may be located on asubstantially level face formed by the first substrate 110 and the blackmatrix 120 so that a gap or an air bubble may not be generated betweenthe first substrate 110 and the polarization structure 130 or betweenthe black matrix 120 and the polarization structure 130.

In embodiments, the polarization structure 130 may include at least onepolarizing layer, a retardation layer, a protection layer, a pluralityof adhesive layers, etc. The adhesive layers may include an adhesivelayer 135 positioned on the second face of the first substrate 110 andon the face of the black matrix 120. The adhesive layer 135 may includea pressure sensitive adhesive. The polarization structure 130 may reduceor prevent a reflection of an external light to thereby improve avisibility of the organic light emitting display device 100.

When the organic light emitting display device 100 has an active matrixtype, the organic light emitting display device 100 may include theswitching structure 140 disposed on the first face of the firstsubstrate 110 in the display region I. For example, the switchingstructure 140 may include a switching element such as a transistor and aplurality of insulation layers.

When the switching element includes a thin film transistor, theswitching element may include a gate electrode, a source electrode, adrain electrode, and an active layer.

The organic light emitting structure 150 may be disposed on theswitching structure 140 in the display region I. The organic lightemitting structure 150 may include a plurality of organic layers. Forexample, the organic light emitting structure 150 may include a holetransfer layer, an organic light emitting layer, an electron transferlayer, etc., and the organic light emitting layer may include an organicmaterial or a mixture of an organic material and an inorganic materialgenerating at least one of a red color of light, a green color of lightand a blue color of light.

The peripheral circuit unit 160 may be disposed on the first substrate110 in the peripheral region II. For example, the peripheral circuitunit 160 may include various peripheral circuits such as a gate drivingcircuit, a data driving circuit, common power supply lines and a drivingpower supply line. The peripheral circuits may receive a signal from anexternal portion, and may transfer the signal to the organic lightemitting structure 150. In embodiments, the peripheral circuit unit 160may be disposed to sufficiently cover the peripheral region II. In someembodiments, the peripheral circuit unit 160 may be positioned tosubstantially surround or enclose the display region I.

Referring now to FIG. 1, the second substrate 170 may be positionedabove the first substrate 110. That is, the second substrate 170 maysubstantially oppose the first substrate 110. The second substrate 170may include a transparent insulating substrate or an opaque insulatingsubstrate. For example, the second substrate 170 may include thetransparent insulating substrate such as a glass substrate, a quartzsubstrate, a transparent resin substrate, etc. Alternatively, the secondsubstrate 170 may include the opaque insulating substrate such as ametal substrate, a metal oxide substrate, etc.

The sealant 180 may be disposed between the first substrate 110 and thesecond substrate 170 to combine or interconnect the first substrate 110and the second substrate 170. Therefore, the sealant 180 may preventwater vapor or contaminants from penetrating into the organic lightemitting structure 150, which may avoid a degradation of the organiclayers in the organic light emitting structure 150.

Although the organic light emitting display device 100 may have a bottomemission type as illustrated in FIG. 1, the invention may not be limitedto the above-described construction. That is, the organic light emittingdisplay device may have a top emission type.

In embodiments, the organic light emitting display device 100 mayinclude the black matrix 120 filling the recess 115 disposed on thesecond face of the first substrate 110 in the peripheral region II. Theblack matrix 120 may serve as a light shielding layer, such that theblack matrix 120 may shield the peripheral circuit unit 160. Therefore,an additional frame or an additional bezel for shielding the peripheralcircuit unit 160 may be omitted. Additionally, the black matrix 120 maybe positioned in the recess 115 of the first substrate 110 to prevent agap or an air bubble from generating between the first substrate 110 andthe polarization structure 130 or between the black matrix 120 and thepolarization structure 130. Accordingly, the mechanical strength of theorganic light emitting display device 100 may be enhanced while adecrease in the visibility of the images may be reduced.

FIG. 3 is a cross-sectional view illustrating an organic light emittingdisplay device in accordance with some embodiments, and FIG. 4 is a planview illustrating a substrate having a black matrix in accordance withsome embodiments.

Referring to FIG. 3, an organic light emitting display device 102 mayinclude a first substrate 112, a black matrix 121, a polarizationstructure 130, a switching structure 140, an organic light emittingstructure 150, a peripheral circuit portion 160, a second substrate 170,a sealant 180, etc. The polarization structure 130, the switchingstructure 140, the organic light emitting structure 150, the peripheralcircuit portion 160, the second substrate 170 and the sealant 180illustrated in FIG. 3 may be substantially the same as or substantiallysimilar to the polarization structure 130, the switching structure 140,the organic light emitting structure 150, the peripheral circuit portion160, the second substrate 170 and the sealant 180 described withreference to FIG. 1, respectively. Thus, for brevity detaileddescription thereof may be simplified or omitted.

Referring to FIG. 3 and FIG. 4, the first substrate 112 may include atransparent insulating substrate. The first substrate may include adisplay region I and a peripheral region II which may be disposed nextto at least one side of the display region I. Although the peripheralregion II may be positioned adjacent to a lower side and a right side ofthe display region I as illustrated in FIG. 4, in alternativeembodiment, the peripheral region II also may be positioned adjacent toone of an upper side, a left side, the lower side and the right side ofthe display region I. In other embodiments, the peripheral region II maybe positioned adjacent to two or three sides among an upper side, a leftside, the lower side and the right side of the display region I. Inembodiments illustrated in FIG. 4, the peripheral region II extendsalong the entire lengths of the lower and right sides. Alternatively,the peripheral region II may extend along a portion of the length of aside of the display region I. The organic light emitting structure 150may be disposed in the display region I, and the peripheral circuit unit160 may be disposed in the peripheral region II.

Referring to FIG. 3, the recess 116 may be formed on a second face ofthe first substrate 112 in the peripheral region II. Thus, the recess116 may be positioned next or adjacent to at least one side of thedisplay region I. As described above, the recess 116 may be positionedadjacent to one, two or three of the upper side, the lower side, theright side and the left side of the display region I.

The black matrix 121 may fill the recess 116 to be positioned next toand substantially extend along at least one of the upper side, the lowerside, the right side and the left side of the display region I.Therefore, the black matrix 121 may have various shapes such as asubstantially bent line shape, a curved line shape, a substantially “U”shape, etc. when viewed in a direction perpendicular to the second face.In embodiments, the black matrix 121 may have a thickness substantiallythe same as a depth of the recess 116. That is, the black matrix 121 mayhave a size substantially the same as or substantially similar to a sizeof the recess 116.

The polarization structure 130 may be disposed on a second face of thefirst substrate 112 and the black matrix 121. As described above, a gapor an air bubble may not be generated between the polarization structure130 and the first substrate 112 or between the polarization structure130 and the black matrix 121.

In embodiments, the organic light emitting display, device 102 mayinclude the black matrix 121 filling the recess 116 which may bedisposed on the second face of the first substrate 112 in the peripheralregion II. In comparison with the organic light emitting display device100 described with reference to FIG. 1, the organic light emittingdisplay device 102 described with reference to FIG. 3 may include theblack matrix 121 that may partially extend along the sides of thedisplay region I. In this case, an additional frame or an additionalbezel for shielding the peripheral circuit unit 160 may be omitted, anda gap or an air bubble may not be occurred between the first substrate112 and the polarization structure 130 or between the black matrix 121and the polarization structure 130.

FIGS. 5 to 8 are cross-sectional views illustrating a method ofmanufacturing an organic light emitting display device in accordancewith embodiments.

Referring to FIG. 5, a first substrate 110 having a display region I anda peripheral region II may be provided. As illustrated in FIGS. 2 and 4,the peripheral region II may contact at least one side of the displayregion I.

In embodiments, a switching structure 140 and an organic light emittingstructure 150 may be sequentially formed on a first face of the firstsubstrate 110 in the display region I, and a peripheral circuit unit 160may be formed on the first face of the first substrate 110 in theperipheral region II. A second substrate 170 may be disposed above thefirst substrate 110 to oppose the first face of the first substrate 110,and the first substrate 110 and the second substrate 170 may be fixed byusing a sealant 180 to complete a display panel of the organic lightemitting display device.

Referring to FIG. 6, a portion of the first substrate 110 may be removedto form a recess 115 on a second face of the first substrate 110.

In embodiments, the recess 115 may be formed in the peripheral region IIthat may contact at least one side of the display region I. In thiscase, the recess 115 may have one of various shapes such as asubstantially line shape, a substantially bent line shape, a curved lineshape, a substantially “U” shape, etc. In some embodiments, the recess115 may be formed in the peripheral region II that may entirely surroundor enclose the four sides of the display region I. In this case, therecess 115 may have various planar shapes such as a substantiallyrectangular band shape, a substantially elliptic band shape, asubstantially circular band shape, a substantially polygonal band shape,etc.

When the first substrate 110 includes a transparent ceramic substratesuch as a glass substrate or a quartz substrate, the recess 115 may beformed by a dry etching process or a wet etching process. Inembodiments, a photoresist pattern or a hard mask may be formed on thesecond face of the first substrate 110, and the first substrate 110 maybe partially etched using the photoresist pattern or the hard mask toform the recess 115 in the peripheral region II.

When the first substrate 110 includes a transparent polymer substrate,the recess 115 may be formed by a dry etching process, a wet etchingprocess or a polishing process. The first substrate 110 including thetransparent polymer substrate may have mechanical strength substantiallylower than the first substrate 110 including the transparent ceramicsubstrate. Therefore, the recess 115 may be formed in the peripheralregion II by performing the polishing process as well as the etchingprocess.

The recess 115 may be formed to have a width substantially the same asthat of the peripheral region II. For example, the recess 115 may have awidth of about 5 mm to about 15 mm. The recess 115 may have a depth in arange of about 5 μm to about 15 μm, so that a ratio of the depth to thewidth of the recess 115 may be about 1:250 to about 1:5,000.

In embodiments, a sidewall of the recess 115 may be substantiallyperpendicular to the second face of the first substrate 110. In someembodiments, a sidewall of the recess 115 may have a predetermined anglewith respect to the second face of the first substrate 110. That is, therecess 115 may have the sidewall inclined by the predetermined anglewith respect to the substrate 100.

Referring to FIG. 7, a black matrix 120 may be formed in the recess 115.

In embodiments, the black matrix 120 may be formed by an ultraviolet(UV) ink printing process. For example, the black matrix 120 may beformed by filling the recess 115 with a black ultraviolet (UV) ink, andirradiating a light having a predetermined wavelength to harden theblack UV ink. In this case, the black matrix 120 may be formed to havevarious planar shapes such as a substantially line shape, asubstantially bent line shape, a curved line shape, a substantially “U”shape, a substantially rectangular band shape, a substantially ellipticband shape, a substantially circular band shape, a substantiallypolygonal band shape, etc. For example, the black UV ink may includeblack silicon or carbon black. The UV ink printing process may beperformed at a relatively low temperature, such that the display panelmay not have thermal damages while forming the black matrix 120 in therecess 115. Alternatively, the black matrix 120 may be formed by a sprayprinting process.

The black matrix 120 may be formed to have a size substantially the sameas or substantially similar to that of the recess 115. Accordingly, astep may not be formed between the exposed face of the black matrix 120and the second face of the first substrate 110.

Referring to FIG. 8, a polarization structure 130 may be formed on thesecond face of the first substrate 110 and the black matrix 120.

In embodiments, an adhesive layer 135 of the polarization structure 130may be formed adjacent to the second face of the first substrate 110.The adhesive layer 135 may include a pressure sensitive adhesive, sothat the polarization structure 130 may adhere to the first substrate110 and the black matrix when a pressure is applied to the adhesivelayer 135. Accordingly, the organic light emitting display device may becompleted.

According to embodiments of the method of manufacturing the organiclight emitting display device, the step may not be formed between thesecond face of the first substrate 110 and the exposed face of the blackmatrix 120. Therefore, the polarization structure 130 may adhere to thefirst substrate 110 without forming the gap or the air bubbletherebetween. Additionally, the black matrix 120 may be formed at arelatively low temperature using the ultraviolet (UV) ink printingprocess without causing damaging to the display panel.

According to embodiments, a gap or an air bubble may not be formedbetween the first substrate and a polarization structure or between theblack matrix and the polarization structure. Therefore, the mechanicalstrength and the visibility of the organic light emitting display devicemay be improved. The organic light emitting display device according toembodiments may be employed in general display apparatuses and variousrecent electronic apparatuses such as e-books, customer products, etc.

The foregoing is illustrative of embodiments and is not to be construedas limiting thereof. Although a few embodiments have been described,those skilled in the art will readily appreciate that many modificationsare possible in the embodiments without materially departing from thenovel teachings and advantages of the invention. Accordingly, all suchmodifications are intended to be included within the scope of theinvention as defined in the claims. In the claims, means-plus-functionclauses are intended to cover the structures described herein asperforming the recited function and not only structural equivalents butalso equivalent structures. Therefore, it is to be understood that theforegoing is illustrative of various embodiments and is not to beconstrued as limited to the specific embodiments disclosed, and thatmodifications to the disclosed embodiments, as well as otherembodiments, are intended to be included within the scope of theappended claims.

What is claimed is:
 1. An organic light emitting display device,comprising: a first substrate comprising a display region and aperipheral region next to at least one side of the display region; anorganic light emitting structure disposed over a first face of the firstsubstrate in the display region; a peripheral circuit portion disposedover the first face of the first substrate in the peripheral region; arecess disposed on a second face of the first substrate in theperipheral region, the second face being opposite to the first face; ablack matrix disposed in the recess; and a polarization structuredisposed over the black matrix and the second face of the firstsubstrate.
 2. The organic light emitting display device of claim 1,wherein the recess has a width of about 5 mm to about 15 mm, wherein aratio of a depth of the recess to the width of the recess is about 1:250to about 1:5,000.
 3. The organic light emitting display device of claim1, wherein a depth of the recess is substantially the same as athickness of the black matrix.
 4. The organic light emitting displaydevice of claim 1, wherein the black matrix includes black silicon orcarbon black.
 5. The organic light emitting display device of claim 1,wherein the peripheral region surrounds the display region.
 6. Theorganic light emitting display device of claim 1, wherein the blackmatrix has a size substantially the same as that of the recess.
 7. Theorganic light emitting display device of claim 6, wherein a surface ofthe black matrix and the second face of the first substrate arepositioned on the same plane.
 8. The organic light emitting displaydevice of claim 6, wherein the black matrix has one selected from thegroup consisting of a line shape, a bent line shape, a curved lineshape, a “U” shape, a rectangular band shape, an elliptic band shape, acircular band shape and a polygonal band shape when viewed in adirection perpendicular to the second face.
 9. The organic lightemitting display device of claim 1, further comprising: a switchingstructure disposed between the first substrate and the organic lightemitting structure in the display region; a second substrate opposingthe first substrate; and a sealant interconnecting the first substrateand the second substrate.
 10. A method of manufacturing an organic lightemitting display device, comprising: providing a display panelcomprising a first substrate, an organic light emitting structuredisposed over a first face of the first substrate and a peripheralcircuit disposed over the first face of the first substrate, the displaypanel having a display region and a peripheral region; partiallyremoving the first substrate to form a recess on a second face of thefirst substrate in the peripheral region; forming a black matrix in therecess; and forming a polarization structure over the second face of thefirst substrate and the black matrix.
 11. The method of claim 10,wherein the peripheral region is positioned next to at least one side ofthe display region.
 12. The method of claim 11, wherein the peripheralregion surrounds the display region.
 13. The method of claim 10, whereinthe recess has a width of about 5 mm to about 15 mm, wherein a ratio ofa depth of the recess to the width of the recess is about 1:250 to about1:5,000.
 14. The method of claim 10, wherein the black matrix has a sizesubstantially the same as that of the recess.
 15. The method of claim10, wherein the black matrix is formed to have one selected from thegroup consisting of a line shape, a bent line shape, a curved lineshape, a “U” shape, a rectangular band shape, an elliptic band shape, acircular band shape and a polygonal band shape when viewed in adirection perpendicular to the second face.
 16. The method of claim 14,wherein the black matrix is formed using black silicon or carbon black.17. The method of claim 10, wherein the first substrate comprises atransparent ceramic substrate, wherein the recess is formed by using adry etching process or a wet etching process.
 18. The method of claim10, wherein the first substrate comprises a transparent polymersubstrate, wherein the recess is formed by using a polishing process.19. The method of claim 10, wherein a surface of the black matrix andthe second face of the first substrate are located on the same plane.